原厂交期: -
类别: 板对板连接器
描述: 针脚数: 560 间距: 0.050" (1.27mm) 连接器类型: High Density Array, Female 排数: 14 安装类型: Surface Mount 特性: Board Guide, Pick and Place 触头镀层: Gold 触头镀层厚度: 30.0µin (0.76µm) 接合堆叠高度: 8.5mm, 9.5mm, 10mm, 13mm, 13.5mm, 15.5mm, 17.5mm, 19.5mm 板上高度: 0.258" (6.55mm) 系列: SEARAY™ SEAF
针脚数 | 560 | 间距 | 0.050" (1.27mm) | 连接器类型 | High Density Array, Female |
排数 | 14 | 安装类型 | Surface Mount | 特性 | Board Guide, Pick and Place |
触头镀层 | Gold | 触头镀层厚度 | 30.0µin (0.76µm) | 接合堆叠高度 | 8.5mm, 9.5mm, 10mm, 13mm, 13.5mm, 15.5mm, 17.5mm, 19.5mm |
板上高度 | 0.258" (6.55mm) | 系列 | SEARAY™ SEAF |